qaar ka mid ah samaynta tixraaca caag silikoon ah oo ku salaysan halogen-free ololka

Halkan waxaa ah shan naqshadood oo caag ah oo silikoon ah oo ku salaysan halogen-free olol dib-u-celin, oo lagu daro ololka dib-u-celinta ee uu bixiyo macaamilka (aluminium hypophosphite, zinc borate, MCA, aluminium hydroxide, iyo ammonium polyphosphate). Nashqadahani waxay ujeedadoodu tahay in la hubiyo dib u dhaca ololka iyada oo la yareynayo qadarka lagu daro si loo yareeyo saameynta qalabka farsamada ee caagga silikoon.

1. Foosfooraska-Nitrogen-isku-dhafan Nidaamka Dib-u-dejinta Ololka (Nooca Samaynta Waxtarka-High-High-Fofficiency)

Bartilmaameedka: UL94 V-0, qiiq yar, oo ku habboon codsiyada heerkulka dhexdhexaadka ah

Salka caag ah: caag silikoon ah oo vinyl vinyl ah (VMQ, 100 phr)

Dab-demiska:

• Aluminium hypophosphite (AHP, fosfooraska ku salaysan): 15 phr
• Waxay bixisaa il fosfooraska wax ku ool ah, waxay kor u qaadaa samaynta dhuxusha, waxayna joojisaa gubashada wejiga gaaska.
• Melamine cyanurate (MCA, nitrogen ku salaysan): 10 phr
• Waxay la shaqaysaa fosfooraska, waxay sii daysaa gaasas aan shaqaynayn, waxayna dishaa ogsijiinta.
• Zinc borate (ZnB): 5 phr
• Waxay kicisaa abuurista char, waxay joojisaa qiiqa, waxayna xoojisaa xasilloonida lakabka char.
• Aluminium hydroxide (ATH, habka kiimikada, 1.6-2.3 μm): 20 phr
• Burburka Endothermic, dib u dhaca ololka caawiyaha, iyo kala firdhinta oo soo hagaagtay.

Wax lagu daro:

• Saliidda silikoon ee Hydroxyl (2 phr, waxay wanaajisaa habsocodka)
• Silica qiiqa leh (10 phr, xoojinta)
• Wakiilka daawada (Diperoxide, 0.8 phr)

Astaamaha:

• Wadarta rarista ololka dib u dhigista ~ 50 phr, dheellitirka dib u dhaca ololka iyo sifooyinka farsamada.
• Isku-dhafka Fosfooraska-nitrojiinka (AHP + MCA) wuxuu yareeyaa qaddarka loo baahan yahay ee dab-demiska shakhsi ahaaneed.

2. Nidaamka Dib u Celinta Ololka Dabiiciga ah (Nooca-Load-hooseeya)

Bartilmaameedka: UL94 V-1 / V-0, oo ku habboon alaabta khafiifka ah

Salka caag ahVMQ (100 phr)

Dab-demiska:

• Ammonium polyphosphate (APP, fosfooraska-nitrogen-ku salaysan): 12 phr
• Xudunta u ah samaynta char intumescent, oo leh waafaqid wanaagsan oo leh caag silikoon ah.
• Aluminium hypophosphite (AHP): 8 ph
• Isha fosfooraska ee dheeriga ah, waxay yaraynaysaa nadaafadda APP.
• Zinc borate (ZnB): 5 phr
• Kicinta charliga is-dhexgalka iyo xakamaynta dhibicda.
• Aluminium hydroxide (dhul, 3-20 μm): 15 phr
• Dib-u-dejinta ololka kaaliyaha ee qiime jaban, wuxuu yareeyaa rarka APP.

Wax lagu daro:

• Saliid silikoon Vinyl (3 phr, balaastiig)
• Silica roobka leh (15 phr, xoojinta)
• Nidaamka daaweynta Platinum (0.1% PT)

Astaamaha:

• Isku geynta ololka dib u dhigista ~ 40 phr, wax ku ool u ah badeecooyinka khafiifka ah sababtoo ah habka dareenka.
• APP waxay u baahan tahay daawaynta dusha sare (tusaale, wakiilka isku xidhka silane) si looga hortago socdaalka.

3. Nidaamka La Habeeyay ee Aluminium Hydroxide-Loading High (Nooca Waxtarka leh)

Bartilmaameedka: UL94 V-0, oo ku habboon alaabada qaro weyn ama fiilooyinka

Salka caag ahVMQ (100 phr)

Dab-demiska:

• Aluminium hydroxide (ATH, habka kiimikada, 1.6-2.3 μm): 50 phr
• Dab-dejinta dabka aasaasiga ah, burburka endothermic, cabbirka qayb yar oo kala firidhsan.
• Aluminium hypophosphite (AHP): 5 phr
• Waxay kordhisaa waxtarka samaynta char, waxay yaraynaysaa rarka ATH.
• Zinc borate (ZnB): 3 phr
• Xakamaynta qiiqa iyo ka hortagga dhalaalka.

Wax lagu daro:

• Wakiilka isku xirka Silane (KH-550, 1 phr, wuxuu hagaajiyaa interface ATH)
• Silica qiiqa leh (8 phr, xoojinta)
• Daaweynta Peroxide (DCP, 1 phr)

Astaamaha:

• Isku geynta ololka dib u dhigista ~ 58 phr, laakiin ATH ayaa ka sareysa hufnaanta qiimaha.
• Cabbirka walxaha yar ee ATH wuxuu yareeyaa luminta xoogga xajinta.

4. Nidaamka Aluminium Hypophosphite (AHP) ee Joogtada ah

Codsiga: UL94 V-1/V-2, ama meelaha aan la rabin ilo nitrogen ah (tusaale, ka fogaanshaha MCA xumbo-samaynta muuqaalka).

Qaabaynta lagu taliyay:

• Salka caag ahVMQ (100 phr)
• Aluminium hypophosphite (AHP): 20-30 phr
• Maadada fosfooraska sare (40%); 20 phr waxay siisaa ~ 8% fosfooraska dib u dhacyada aasaasiga ah ee ololka.
• UL94 V-0, kor u kaca ilaa 30 phr (waxaa laga yaabaa inay waxyeeleyso sifooyinka farsamada).
• Buuxiyaha XoojintaSilica (10-15 phr, waxay ilaalisaa awoodda)
• Wax lagu daroSaliida silikoon ee Hydroxyl (2 phr, habsocodka) + wakiilka daaweynta (Diperoxide ama nidaamka platinum).

Astaamaha:

• Waxay ku tiirsan tahay dib u dhigista ololka wejiga-isku-duuban (samaynta dhuxusha), si weyn ayay u wanaajisaa LOI laakiin waxay leedahay xakamaynta qiiqa xaddidan.
• Culays sare (> 25 phr) ayaa laga yaabaa inay adkeeyaan walxaha; ku talin in lagu daro 3-5 phr ZnB si loo horumariyo tayada char.

5. Aluminium Hypophosphite (AHP) + Isku-dhafka MCA

Codsiga: UL94 V-0, rarida hoose oo leh is-dhexgalka ololka gaaska-wajiga.

Qaabaynta lagu taliyay:

• Salka caag ahVMQ (100 phr)
• Aluminium hypophosphite (AHP): 12-15 phr
• Fosfooraska isha ee abuuritaanka char.
• MCA: 8-10 phr
• Isha Nitrogen ee isku-dhafka PN, waxay sii deysaa gaas aan shaqaynayn (tusaale, NH₃) si loo xakameeyo faafinta ololka.
• Buuxiyaha XoojintaSilica (10 phr)
• Wax lagu daroWakiilka isku xirka Silane (1 phr, gargaarka kala firdhinta) + wakiilka daaweynta.

Astaamaha:

• Isku geynta ololka dib u dhigista ~ 20-25 phr, oo aad uga hooseeya AHP taagan.
• MCA waxay yaraynaysaa shuruuda AHP laakiin waxa laga yaabaa inay wax yar saamayso daahfurnaanta (isticmaal nano-MCA haddii loo baahdo caddayn).

Soo koobida Habaynta Ololka Retardant

Talooyin tijaabo ah

1. Tijaabada MudnaantaAHP + MCA (15+10 phr). Haddii V-0 la gaaro, si tartiib tartiib ah u yaree AHP (tusaale, 12+10 phr).
2. Tijaabada AHP ee kali ahKa bilow 20 phr, kordhinta 5 phr si loo qiimeeyo LOI iyo UL94, la socodka guryaha farsamada.
3. Xakamaynta qiiqaKu dar 3-5 phr ZnB qaab kasta adoon wax u dhimayn dib u dhaca ololka.
4. Kordhinta QiimahaKu dar 10-15 phr ATH si loo dhimo kharashka, in kastoo wadarta buuxinta buuxinta ay korodho.

Habka isku darka ee lagu taliyay

(Laba qaybood oo dheeri ah oo lagu daaweeyo caag silikoon ah)

1. Daawaynta ka hor caagga saldhiga:

• Ku shub caag silikoon ah (tusaale, 107 xanjo, saliid silikoon vinyl ah) geli qasiyaha meeraha, dareeraha faakuumka hoostiisa haddii loo baahdo.

1. Ku darida Ololka Retardant:

• Dib u celiyaasha ololka budada ah (tusaale, ATH, MH):
• Ku dar dufcadaha, horay ugu qas caag salka (isku-darka xawaaraha hooseeya, 10-15 daqiiqo) si aad uga fogaato xanaaq.
• Ku qallaji heerkulka 80-120 ° C haddii hygroscopic.
• Dareereyaasha ololka dareeraha ah (tusaale, phosphates):
• Si toos ah ugu walaaq saliid silikoon, crosslinker, iwm., hoos xiirid sare (20-30 daqiiqo).

1. Waxyaabaha kale ee lagu daro:

• Si isdaba joog ah ugu dar wax-buuxiyeyaasha (tusaale, silica), crosslinker (hydrosilane), kicinta (platinum), iyo horjoogayaasha.

1. Homogenization:

• Sifee fidinta dheeraadka ah iyadoo la isticmaalayo mishiinka saddex duuban ama emulsifier-xiir sare leh (muhiim u ah waxyaabaha lagu daro nano sida CNTs).

1. Degasaynta & Shaandhaynta:

• Vacuum degas (-0.095 MPa, 30 min), shaandheynta shuruudaha nadiifnimada sare.

Tixgelinta Muhiimka ah

• Xulashada Ololka Retardant:
• Dib-u-dhiseyaasha aan halogen-la'aanta ahayn (tusaale, ATH) waxay u baahan yihiin cabbirka qayb yar (1-5 μm); rarka xad-dhaafka ah waxay waxyeelo u geysataa sifooyinka farsamada.
• Silikoon-ku-salaysan dib-u-dhigista (tusaale, resins silikoon phenyl) waxay bixiyaan iswaafajin ka wanaagsan laakiin qiimo sare leh.
• Xakamaynta habka:
• Heerkulka ≤ 60°C (waxay ka hortagtaa sumowga platinum katalyst ama daawaynta degdega ah).
• Qoyaanka ≤ 50% RH (wuxuu ka ilaaliyaa falcelinta ka dhexaysa saliidda silikoonka hydroxyl iyo ololka dib u dhiga).

Gabagabo

• Wax-soo-saarka guud: Ka hor isku-darka dab-demiska ololka leh caag salka u ah waxtarka.
• Shuruudaha Xasiloonida SareIsku qas inta lagu jiro isku-darka si loo yareeyo khatarta kaydinta.
• Nidaamyada Retardant Nano-Flame: Kala firdhinta xiirta sare ee qasabka ah si looga hortago xad gudubka.

More info., pls contact lucy@taifeng-fr.com