Naqshadaynta Formula ee MCA iyo Aluminium Hypophosphite (AHP) ee ku jira Dahaarka Kala soocida ee Dib u Dhigista Ololka
Iyada oo ku saleysan shuruudaha gaarka ah ee isticmaalaha ee dahaarka kala soocida ololka, sifooyinkaMelamine Cyanurate (MCA)iyoAluminium Hypophosphite (AHP)waxaa loo lafa guray sida soo socota:
1. Waafaqid Nidaamyada Slurry
- MCA:
- Nidaamyada aqueous:Wuxuu u baahan yahay wax ka beddelka dusha sare (tusaale, wakiilada isku-xidhka silane ama qalab-sameeyaha) si loo hagaajiyo kala firdhisanaanta; Haddii kale, agglomeration ayaa dhici karta.
- Nidaamyada NMP:Waxaa laga yaabaa inay barar yar ku soo bandhigto dareerayaasha dabaylaha (lagu taliyay: tijaabi heerka bararka ka dib 7-maalmood quusin).
- AHP:
- Nidaamyada aqueous:Kala firdhisanaan wanaagsan, laakiin pH waa in la xakameeyaa (xaalad aysiidh ah ayaa laga yaabaa inay keento hydrolysis).
- Nidaamyada NMP:Degganaanshiyo kiimiko oo sarreeya oo leh khatarta bararka ugu yar.
Gabagabo:AHP waxay muujinaysaa waafaqid ka wanaagsan, halka MCA ay u baahan tahay wax ka beddel.
2. Cabbirka Walxaha iyo La qabsiga Habka Dahaarka
- MCA:
- Asalka D50: ~ 1-2 μm; waxay u baahan tahay shiidid (tusaale, ciid-shiidid) si loo yareeyo cabbirka walxaha, laakiin waxa laga yaabaa inay dhaawici karto qaab-dhismeedkeeda lakabka ah, taasoo saamaynaysa waxtarka-dib-u-dhigista ololka.
- Midnimada shiida ka dib waa in la xaqiijiyaa (fiiri SEM).
- AHP:
- Asalka D50: Caadiyan ≤5 μm; shiidid ilaa D50 0.5 μm/D90 1 μm waa la gaari karaa
Gabagabo:MCA waxay leedahay la qabsiga cabbirka walxaha ka sii wanaagsan oo leh khatarta habka hoose.
3. Isku-xidhka iyo Iska-caabbinta Abrasion
- MCA:
- Polarity hooseeya waxay keenaysaa adhesion liidata oo leh filimada kala soocida PE/PP; waxay u baahan tahay 5-10% xidheyaal akrilik ku salaysan (tusaale, PVDF-HFP).
- Isku-dhafka sare ee isku-dhafka ayaa laga yaabaa inuu u baahdo ku darista 0.5-1% nano-SiO₂ si loo hagaajiyo caabbinta xirashada.
- AHP:
- Kooxaha dusha sare ee hydroxyl waxay sameeyaan curaarta hydrogen ee kala soocida, hagaajinta adhesion, laakiin 3-5% polyurethane xidhayaasha ayaa wali loo baahan yahay.
- adkaanta sare (Mohs ~ 3) waxa laga yaabaa inay sababto daadashada qayb yar oo ka mid ah xuubabka yar yar ee is jiid-jiidka daba dheeraaday (waxay u baahan tahay tijaabo wareeg ah).
Gabagabo:AHP waxay bixisaa waxqabad guud oo wanaagsan laakiin waxay u baahan tahay hagaajinta xidhidhka.
4. Dejinta kulaylka iyo Guryaha Burbursan
- MCA:
- Heerkulka burburka: 260-310 ° C; ma dhalin karo gaas 120-150°C, taasoo suurtogal ah inay ku guul daraysato inay xakamayso socodka kulaylka.
- AHP:
- Heerkulka burburka: 280-310 ° C, sidoo kale kuma filna jiilka gaaska heerkulka hooseeya.
Arrin Muhiim ah:Labaduba waxa ay ka sarreeyaan inta la beegsanayo (120-150°C).Xalka: - Soo bandhig kuwa kulaylka hooseeya (tusaale, fosfooraska cas microencapsulated, kala goynta kala duwan: 150-200°C) ama ammonium polyphosphate oo la beddelay (APP, dahaarka leh si loo hagaajiyo burburka ilaa 140-180°C).
- Naqshad anIsku-dhafka MCA/APP (6:4 saamiga)si looga faa'iidaysto jiilka gaaska heerkulka hooseeya ee APP + xakamaynta ololka wajiga gaaska ee MCA.
5. Iska caabinta korantada iyo daxalka
- MCA:
- Electrochemically anert, laakiin hadhaaga melamine bilaashka ah (nadiifinta ≥99.5% loo baahan yahay) waxay kicin kartaa burburka korantada.
- AHP:
- wasakhda aysidhka ah (tusaale, H₃PO₂) waa in la yareeyaa (Tijaabada ICP: ion biraha ≤10 ppm) si looga fogaado dardargelinta LiPF₆ hydrolysis.
Gabagabo:Labaduba waxay u baahan yihiin nadiif sare (≥99%), laakiin MCA way fududahay in la nadiifiyo.
Soo jeedinta Xalka Dhamaystiran
- Xulashada Ololka Hore:
- La door biday:AHP (kala-firdhinta/adhesion isku dheeli tiran) + isku-dubarid heerkul hoose ah (tusaale, 5% fosfooraska cas ee microencapsulated).
- Beddelka:MCA la beddelay (carboxyl-ku-tallaalid loogu talagalay kala firdhinta aqueous) + APP synergist.
- Habraaca Hagaajinta:
- Caano-xumada:AHP (90%) + polyurethane binder (7%) + wakiilka qoynta (BYK-346, 0.5%) + defoamer (2%).
- Halbeegyada wax shiididda:Warshad ciid leh 0.3 mm ZrO₂ kuul, 2000 rpm, 2 saac (bartilmaameedka D90 ≤1 μm).
- Tijaabooyinka Xaqiijinta:
- Burburka kulaylka:TGA (miisaan dhimis <1% at 120°C/2h; soosaarka gaaska 150°C/30min iyada oo loo sii marayo GC-MS).
- Degganaanshaha korantada:U fiirsashada SEM ka dib 30-maalmood immersion gudaha 1M LiPF₆ EC/DMC at 60°C.
Talo soo jeedintii u dambaysay
MCA iyo AHP midna ma buuxinayo dhammaan shuruudaha. Anidaamka isku-dhafka ahwaxaa lagula talinayaa:
- AHP (matrix)+Fosfooraska cas microencapsulated (gaas dhaliyaha heerkulka hooseeya)+nano-SiO₂(iska caabinta nabarrada).
- Ku dheji xabagta aqueous-ku-dhejin-sare leh (tusaale, emulsion-ka acrylic-epoxy composite emulsion) oo wanaaji beddelka dusha sare ee cabbirka walxaha/ xasilloonida kala firdhiso.
Baaritaan dheeraad ahayaa loo baahan yahay si loo ansixiyo isku-dhafka kulaylka-electrochemical.
Waqtiga boostada: Abriil-22-2025